The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2017

Filed:

Oct. 29, 2014
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Roey Shaviv, Palo Alto, CA (US);

Ismail T. Emesh, Sunnyvale, CA (US);

Assignee:

APPLIED Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); C25D 7/12 (2006.01); C25D 5/34 (2006.01); C25D 17/00 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76843 (2013.01); C25D 5/34 (2013.01); C25D 7/123 (2013.01); C25D 17/001 (2013.01); H01L 21/02068 (2013.01); H01L 21/6723 (2013.01); H01L 21/76862 (2013.01); H01L 21/76864 (2013.01); H01L 21/76873 (2013.01);
Abstract

In one embodiment of the present disclosure, a method for electrochemical deposition on a workpiece includes (a) obtaining a workpiece including a feature; (b) depositing a first conductive layer in the feature; (c) moving the workpiece to an integrated electrochemical deposition plating tool configured for hydrogen radical H* surface treatment and electrochemical deposition; (d) treating the first conductive layer using a hydrogen radical H* surface treatment in a treatment chamber of the plating tool to produce a treated first conductive layer; and (e) maintaining the workpiece in the same plating tool and depositing a second conductive layer in the feature on the treated first conductive layer in an electrochemical deposition chamber of the plating tool.


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