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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9768059 B1

PDFFull Text
Date of Patent:
Sep. 19, 2017

Filed:

Apr. 07, 2016

High-chi block copolymers for interconnect structures by directed self-assembly

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Chi-Chun Liu, Altamont, NY (US);

Teddie P. Magbitang, San Jose, CA (US);

Daniel P. Sanders, San Jose, CA (US);

Kristin Schmidt, Mountain View, CA (US);

Ankit Vora, San Jose, CA (US);

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorney:

Michael R. Roberts

Primary Examiner:

Amanda C Walke

Int. Cl.
CPC ...
G03F 7/004 (2006.01); H01L 21/768 (2006.01); C08G 81/02 (2006.01); C23F 1/00 (2006.01); G03F 7/20 (2006.01); G03F 7/40 (2006.01); G03F 7/00 (2006.01); G03F 7/16 (2006.01); G03F 7/32 (2006.01); B82Y 40/00 (2011.01); H01L 21/3065 (2006.01); H01L 21/027 (2006.01); B82Y 10/00 (2011.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76802 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); C08G 81/027 (2013.01); C23F 1/00 (2013.01); G03F 7/002 (2013.01); G03F 7/165 (2013.01); G03F 7/20 (2013.01); G03F 7/2022 (2013.01); G03F 7/2059 (2013.01); G03F 7/32 (2013.01); G03F 7/40 (2013.01); H01L 21/0274 (2013.01); H01L 21/3065 (2013.01); H01L 21/02112 (2013.01);
Abstract

High-chi diblock copolymers are disclosed whose self-assembly properties are suitable for forming hole and bar openings for conductive interconnects in a multi-layered structure. The hole and bar openings have reduced critical dimension, improved uniformity, and improved placement error compared to the industry standard poly(styrene)-b-poly(methyl methacrylate) block copolymer (PS-b-PMMA). The BCPs comprise a poly(styrene) block, which can optionally include repeat units derived from trimethylsilyl styrene, and a second block that can be a polycarbonate block or a polyester block. Block copolymers comprising a fluorinated linking group L' comprising 1-25 fluorines between the blocks can provide further improvement in uniformity of the openings.

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