The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2017

Filed:

Dec. 01, 2015
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Dae-Won Kim, Seoul, KR;

Jae-Kyu Lee, Seongnam-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-Si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/24 (2006.01); H01L 45/00 (2006.01); H01L 21/762 (2006.01); H01L 21/308 (2006.01); H01L 27/108 (2006.01);
U.S. Cl.
CPC ...
H01L 21/762 (2013.01); H01L 21/3083 (2013.01); H01L 27/10814 (2013.01); H01L 27/10817 (2013.01); H01L 27/10823 (2013.01); H01L 27/2436 (2013.01); H01L 27/2463 (2013.01); H01L 45/06 (2013.01); H01L 45/1233 (2013.01); H01L 45/144 (2013.01);
Abstract

A method of forming patterns of a semiconductor device, including partially etching an upper portion of a substrate to form first preliminary active patterns and a first trench, each of the first preliminary active patterns having a first width, and the first trench having a second width of about 2 to 3 times the first width; forming an insulating spacer on each sidewall of the first trench to form a second trench having the first width; forming a second preliminary active pattern in the second trench, the second preliminary active pattern having the first width; partially etching the first and second preliminary active patterns to form a plurality of first active patterns and a plurality of second active patterns and an opening between the plurality of first and second active patterns; and forming an insulation pattern to fill the opening.


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