The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2017
Filed:
Oct. 12, 2015
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Karsten Guth, Soest, DE;
Guido Strotmann, Anroechte, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01L 21/48 (2006.01); H01L 23/053 (2006.01); H01L 23/498 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4817 (2013.01); H01L 21/4889 (2013.01); H01L 23/053 (2013.01); H01L 23/49811 (2013.01); H01L 23/3735 (2013.01); H01L 24/06 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/83 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/40091 (2013.01); H01L 2224/40101 (2013.01); H01L 2224/40105 (2013.01); H01L 2224/40157 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48157 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/8546 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85424 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85447 (2013.01); H01L 2224/92246 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01);
Abstract
One aspect of the invention relates to an electronic module comprising a module housing and an electrically conductive connection element. The connection element has a first portion and a second portion, and also a shaft between the first portion and the second portion. The connection element, which is provided with a non-metallic coating in the region of the shaft, is injected together with the coating in the region of the shaft into the module housing, such that the connection element is fixed in the module housing.