The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2017
Filed:
Jun. 16, 2016
Yongkong Siew, Suwon-si, KR;
Sung-yup Jung, Hwaseong-si, KR;
Yongkong Siew, Suwon-si, KR;
Sung-Yup Jung, Hwaseong-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A method of fabricating a semiconductor device includes forming a target layer on a substrate, forming a plurality of reference patterns at uniform intervals on the target layer, forming a plurality of spacers on the side surfaces of the reference patterns, forming a plurality of filling patterns in spaces left between the spacers, forming a surface-modified filling pattern by performing a first surface treatment on a portion of the plurality of filling patterns, forming a surface-modified reference pattern by performing a second surface treatment on a portion of the plurality of reference patterns, and removing the plurality of filling patterns and the plurality of reference patterns and leaving the surface-modified filling pattern and the surface-modified reference pattern on the target layer.