The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2017
Filed:
Feb. 15, 2017
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Scott Powers, San Diego, CA (US);
Thomas Bryan, Carlsbad, CA (US);
Andrew Tohmc, San Mateo, CA (US);
Subrahmanya Pradeep Morusupalli, Bengaluru, IN;
Tin Tin Wee, San Diego, CA (US);
Kenneth Dubowski, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/40 (2006.01); G11C 11/4096 (2006.01); G11C 11/408 (2006.01); G11C 11/4094 (2006.01); H01L 25/18 (2006.01); H01L 25/065 (2006.01); H01L 23/66 (2006.01); H03H 7/38 (2006.01);
U.S. Cl.
CPC ...
G11C 11/4096 (2013.01); G11C 11/4085 (2013.01); G11C 11/4094 (2013.01); H01L 23/66 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H03H 7/38 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6627 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06586 (2013.01);
Abstract
A die is provided having an unterminated endpoint that capacitively loads its input impedance with a capacitance from capacitor while acting as a receiving endpoint and that isolates its output impedance from the capacitance while acting as a transmitting endpoint.