The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2017

Filed:

May. 21, 2013
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Beijing Boe Optoelectronics Technology Co., Ltd., Beijing, CN;

Inventors:

Zhengxin Zhang, Beijing, CN;

Yi Zheng, Beijing, CN;

Shuai Xu, Beijing, CN;

Yao Yu, Beijing, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G09G 3/34 (2006.01); G02F 1/167 (2006.01); G09G 3/20 (2006.01);
U.S. Cl.
CPC ...
G09G 3/344 (2013.01); G02F 1/167 (2013.01); G09G 3/2014 (2013.01); G09G 2300/0426 (2013.01); G09G 2310/0275 (2013.01); G09G 2310/061 (2013.01); G09G 2320/041 (2013.01);
Abstract

The present disclosure discloses a driving circuit for electrophoretic display, including a data line driving integrated circuit and a gate line driving integrated circuit, characterized in that the output terminal of each data line in the data line driving integrated circuit is configured with a modulation unit including a thermosensitive element, and the modulation unit adjusts the pulse width of the voltage signal outputted at the output terminal of the data line according to change of temperature to realize temperature compensation for the dielectric characteristic of the electrophoretic film of the electrophoretic display. The present disclosure also discloses an implementation method of the driving circuit and an electrophoretic display device. According to the present disclosure, the workload of the early stage experiment process of the product design can be saved, the production efficiency of the products can be improved, and the storage space of the chip can also be saved.


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