The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2017

Filed:

Apr. 22, 2015
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Brandon S. Smith, Scotts Valley, CA (US);

Thomas R. Tate, San Jose, CA (US);

Mark A. Salvador, Fremont, CA (US);

Alexander C. Calkins, San Francisco, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); G06F 1/16 (2006.01); H01Q 1/52 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1656 (2013.01); G06F 1/1681 (2013.01); G06F 1/1698 (2013.01); H01Q 1/2266 (2013.01); H01Q 1/526 (2013.01);
Abstract

A shield feature and method of forming to prevent transmission of electromagnetic radiation is disclosed. The shield feature may include a first protrusion and a second protrusion, both of which are formed from an electrically conductive material. A non-electrically conductive material may cover the electrically conductive material in certain regions. The first protrusion, the second protrusion, and an extension between the first protrusion and the second protrusion are free of non-electrically conductive material, allowing the electrically conductive material to engage an enclosure of an electronic device. Also, a distance separates the first protrusion and the second protrusion that is less than a distance defined by a wavelength of the electromagnetic radiation, allowing the shield feature to prevent the electromagnetic radiation from passing through the shield feature. Also, the shield feature may further form an electrical grounding path for an internal component to electrically ground the internal component with the enclosure.


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