The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2017

Filed:

May. 15, 2012
Applicants:

John A. Rogers, Champaign, IL (US);

Hoon-sik Kim, Champaign, IL (US);

Yonggang Huang, Glencoe, IL (US);

Inventors:

John A. Rogers, Champaign, IL (US);

Hoon-Sik Kim, Champaign, IL (US);

Yonggang Huang, Glencoe, IL (US);

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/08 (2010.01); F21K 9/00 (2016.01); H01L 23/00 (2006.01); F21V 29/70 (2015.01); H01L 25/075 (2006.01); H01L 33/64 (2010.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01); H01L 21/56 (2006.01); F21Y 105/12 (2016.01); F21Y 105/10 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21K 9/00 (2013.01); F21V 29/70 (2015.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); F21Y 2105/10 (2016.08); F21Y 2105/12 (2016.08); F21Y 2115/10 (2016.08); H01L 21/568 (2013.01); H01L 25/0753 (2013.01); H01L 33/647 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/73267 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/13063 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/181 (2013.01); H01L 2924/351 (2013.01); H05K 1/0201 (2013.01); H05K 1/16 (2013.01);
Abstract

Provided herein are electronic devices including arrays of printable light emitting diodes (LEDs) having device geometries and dimensions providing enhanced thermal management and control relative to conventional LED-based lighting systems. The systems and methods described provide large area, transparent, and/or flexible LED arrays useful for a range of applications in microelectronics, including display and lightning technology. Methods are also provided for assembling and using electronic devices including thermally managed arrays of printable light emitting diodes (LEDs).


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