The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2017

Filed:

Jun. 26, 2014
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Sohaib Elgimiabi, Neuss, DE;

Frank Neuroth, Neuss, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); B32B 3/12 (2006.01); C08G 59/38 (2006.01); C08G 59/42 (2006.01); B29C 70/66 (2006.01); B29C 44/18 (2006.01); C08G 59/50 (2006.01); C08K 7/24 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); B29C 44/186 (2013.01); B29C 70/66 (2013.01); B32B 3/12 (2013.01); C08G 59/38 (2013.01); C08G 59/42 (2013.01); C08G 59/4238 (2013.01); C08G 59/5086 (2013.01); C08K 7/24 (2013.01); B32B 2260/046 (2013.01); B32B 2419/04 (2013.01); B32B 2605/003 (2013.01); B32B 2605/18 (2013.01); Y02T 50/433 (2013.01);
Abstract

Curable compositions are provided comprising (i) at least one epoxy resin as specified (ii) an epoxide hardener system comprising (a) a carboxylic acid anhydride, (b) a first amine having a melting point from about 30 C to about 100 C and containing at least one primary amine group; and (c) a second amine having a melting point of from about 50 C to about 180 C and having at least one primary amine group, wherein the first and second amines are selected such that they have a difference in melting points of at least 10 C and wherein the first and second amines are contained in minor amounts by weight as compared to the carboxylic acid anhydride; and (iii) a filler as specified. Also provided are compositions obtainable by curing the curable composition, the use of the curable composition for filling of voids in honeycomb structures and processes for filing voids in honeycomb structures.


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