The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2017
Filed:
Aug. 13, 2013
Applicant:
Promerus, Llc, Brecksville, OH (US);
Inventors:
Christopher Apanius, Moreland Hill, OH (US);
Andrew Bell, Lakewood, OH (US);
Leah Langsdorf, Akron, OH (US);
W. C. Peter Tsang, Broadview Heights, OH (US);
Assignee:
PROMERUS, LLC, Brecksville, OH (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/09 (2006.01); C08L 69/00 (2006.01); H01L 23/29 (2006.01); H05K 13/00 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
C08K 5/09 (2013.01); C08L 69/00 (2013.01); H01L 23/293 (2013.01); H05K 13/0046 (2013.01); H05K 13/0465 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/01322 (2013.01);
Abstract
Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.