The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2017

Filed:

Sep. 22, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Yeon-Woo Kim, Suwon-si, KR;

Jeong Woo, Yongin-si, KR;

Jung-Sik Park, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H02G 3/18 (2006.01); H04M 1/00 (2006.01); H05K 5/00 (2006.01); H01R 12/57 (2011.01); H01R 13/24 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0047 (2013.01); H01R 12/57 (2013.01); H01R 13/2407 (2013.01); H05K 1/0213 (2013.01); H05K 5/0017 (2013.01);
Abstract

An electronic device is provided. The electronic device includes a housing that includes a first surface directed in the first direction, a second surface directed in a second direction opposite to the first direction, and a lateral side that surrounds, at least in part, a space formed between the first surface and the second surface, a display, an antenna radiating body, a printed circuit board including a first hole and a metal member positioned in the first hole, a flexible connecting member disposed between a portion of the antenna radiating body and a portion of the metal member, a conductive plate configured for contacting the connecting member, or being formed by a portion of the connecting member to include a second hole, and a coupling member for coupling the conductive plate to the printed circuit board by passing through the second hole and contacting with the metal member.


Find Patent Forward Citations

Loading…