The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2017

Filed:

Mar. 11, 2016
Applicant:

Continental Automotive Systems, Inc., Auburn Hills, MI (US);

Inventors:

Donald J. Zito, Fox River Grove, IL (US);

David Wayne Currier, McHenry, IL (US);

Keith A Meny, Wheeling, IL (US);

Leobardo Martinez Hernandez, Palatine, IL (US);

Russ Dalbke, Fox River Grove, IL (US);

Peter Lechowicz, West Dundee, IL (US);

Assignee:

Continental Automotive Systems, Inc., Auburn Hills, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01); H01G 9/008 (2006.01); H05K 5/03 (2006.01); H01G 9/06 (2006.01); H01G 9/08 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01G 9/008 (2013.01); H05K 1/11 (2013.01); H05K 1/184 (2013.01); H05K 3/30 (2013.01); H05K 3/303 (2013.01); H05K 3/32 (2013.01); H05K 3/3421 (2013.01); H05K 5/03 (2013.01); H01G 9/06 (2013.01); H01G 9/08 (2013.01); H05K 1/183 (2013.01); H05K 2201/10015 (2013.01);
Abstract

A retention structure which provides both soldering and vibration stabilization of a capacitor as the capacitor is mounted to a printed circuit board (PCB) of an electronic module. An aperture is part of the PCB to stabilize and prevent the capacitor from rolling during manufacturing. Once secured to the PCB, Room Temperature Vulcanization (RTV), or similar adhesive bead, is placed onto a rigidizer or base plate (typically a casted or aluminum sheet plate). Once the capacitor is soldered in place and fixated on the PCB, the assembly is then placed onto the rigidizer such that the PCB is attached to the rigidizer using an adhesive, and the RTV bead contacts and is deformed by the capacitor, connecting the capacitor to the rigidizer to provide vibration stabilization support. The electronic module includes a cover, and optional dampening/constraint pads are attached to the cover of the electrolytic capacitor for additional vibration stabilization.


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