The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2017

Filed:

Apr. 07, 2016
Applicant:

Oregon State University, Corvallis, OR (US);

Inventors:

Chih-Hung Chang, Corvallis, OR (US);

Chang-Ho Choi, Corvallis, OR (US);

Assignee:

Oregon State University, Corvallis, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/09 (2006.01); H01L 31/02 (2006.01); H05K 3/12 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/097 (2013.01); H01L 31/02008 (2013.01); H05K 3/1241 (2013.01); H05K 1/0393 (2013.01); H05K 2203/0786 (2013.01); H05K 2203/1157 (2013.01);
Abstract

Highly conductive silver may be fabricated at room temperature using in-situ reactive silver precursor inks by microreactor-assisted printing without any post-processing. Reactive silver nanoinks, synthesized in-situ from the microreactor, may be directly delivered onto glass and polymeric substrates without any surface treatment to form a highly dense and uniform silver feature. The distribution of the reactive silver nanoinks can be controlled by adjusting the flow rate of the continuous flow. Silver lines may be fabricated using the in-situ reactive precursors delivered via a micro-channel applicator.


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