The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2017
Filed:
Mar. 14, 2013
Method and apparatus for providing a ground and a heat transfer interface on a printed circuit board
Cisco Technology, Inc., San Jose, CA (US);
James A. Mass, North Royalton, OH (US);
David Lynn Artman, Bruswick, OH (US);
Timothy A. Frank, Parma, OH (US);
Cisco Technology, Inc., San Jose, CA (US);
Abstract
In one embodiment, a printed circuit board (PCB) assembly includes a PCB, the PCB being arranged to define a through-hole therein, the through-hole having a surface, wherein the PCB includes a top surface and a bottom surface. The PCB assembly also includes a slug arrangement and a surface mount component. The slug arrangement is formed from an electrically and thermally conductive material and includes at least a first portion and a second portion. At least a part of the first portion is positioned in the through-hole, and the second portion is coupled to the bottom surface. The surface mount component is positioned over the through-hole and the top surface, and has a first surface configured to contact the first portion.