The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2017
Filed:
Apr. 08, 2013
Peking University, Beijing, CN;
Haixia Zhang, Beijing, CN;
Xiaosheng Zhang, Beijing, CN;
Mengdi Han, Beijing, CN;
Fuyun Zhu, Beijing, CN;
PEKING UNIVERSITY, Beijing, CN;
Abstract
The present disclosure discloses an integrated micro/nanogenerator and a method of fabricating the same The integrated micro/nanogenerator has a structure comprising a conducting layer, a PET layer, a PDMS layer, a micro-nano hierarchical PDMS array and a metal film layer, the conducting layer being manufactured on a surface of the PET layer, the PET layer being made of polyethylene terephthalate; the PDMS layer being made of polydimethylsiloxane, and the micro-nano hierarchical PDMS array being manufactured on a surface of the PDMS layer. The method comprises steps of: 1) fabricating a micro-scale structure on a substrate through a combination of lithography and chemical etching or physical etching; 2) fabricating a nano-scale structure with high density and high depth-to-width ratio directly on a surface of the micro-scale structure through a mask-free optimized deep reactive ion etching process; 3) using a PDMS casting film transfer process by adjusting and controlling process parameters, by means of using the mold of mirco-nano hierarchical array structure as a template; 4) fabricating a conducting layer on a surface of the PET layer by using an evaporation or sputtering or chemical vapor deposition process; 5) bonding the PDMS layer and the PET layer through high temperature bonding or normal temperature physical pressing; and 6) assembling in sequence and packaging the bonded structure obtained in step 5), the metal film layer, and another bonded structure obtained in step 5).