The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2017

Filed:

Feb. 03, 2012
Applicant:

Viswa N. Sharma, San Ramon, CA (US);

Inventor:

Viswa N. Sharma, San Ramon, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02M 1/10 (2006.01); H02M 3/335 (2006.01); H02M 5/22 (2006.01); H02M 7/48 (2007.01); H02M 7/797 (2006.01);
U.S. Cl.
CPC ...
H02M 1/10 (2013.01); H02M 3/33584 (2013.01); H02M 5/225 (2013.01); H02M 7/4807 (2013.01); H02M 7/797 (2013.01); H02M 2007/4815 (2013.01); Y02B 70/1441 (2013.01);
Abstract

The apparatus of present invention converts AC or DC power sources to AC or DC power loads, in a single stage, bidirectionally, employing variable, high frequency resonant circuits and power switches, to continuously vary the gain of the conversion circuit. Inrush current control, idle converter turn off, line voltage brown out protection, soft start, high pre-charge voltage generation, soft shut down, and dimming operation are inherent characteristics of the apparatus of the instant invention. A remotely configurable and operable controller may optionally be used to control the mode of conversion, the amplitude and frequency of the output voltages. The resonant circuits can be paralleled to derive multiple outputs. Multiple converter stages can be cascaded to meet the various power needs of an application such as multiple outputs and different amplitudes. Components can be eliminated for specific conversion applications. The circuits can be implemented in semiconductor packages.


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