The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2017

Filed:

Jan. 14, 2014
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Johann Eibl, Wald, DE;

Sebastian Taeger, Bad Abbach, DE;

Lutz Höppel, Alteglofsheim, DE;

Karl Engl, Pentling, DE;

Stefanie Rammelsberger, Zeitlarn, DE;

Markus Maute, Alteglofsheim, DE;

Michael Huber, Bad Abbach, DE;

Rainer Hartmann, Regensburg, DE;

Georg Hartung, Nesselwang, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/54 (2010.01); H01L 33/44 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 21/02 (2006.01); H01L 33/52 (2010.01); H01L 33/40 (2010.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 33/44 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); G01B 2210/306 (2013.01); H01L 21/0228 (2013.01); H01L 33/405 (2013.01); H01L 33/52 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/181 (2013.01); H01L 2933/005 (2013.01);
Abstract

An optoelectronic semiconductor chip includes a semiconductor body with an active region provided for generating electromagnetic radiation, a first mirror layer provided for reflecting the electromagnetic radiation, a first encapsulation layer formed with an electrically insulating material, and a carrier provided for mechanically supporting the first encapsulation layer, the first mirror layer and the semiconductor body. The first mirror layer is arranged between the carrier and the semiconductor body. The first encapsulation layer is arranged between the carrier and the first mirror layer. The first encapsulation layer is an ALD layer.


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