The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2017

Filed:

Apr. 02, 2014
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventors:

Grigoriy Basin, San Jose, CA (US);

Mikhail Fouksman, San Jose, CA (US);

Assignee:

KONINKLIJKE PHILIPS N.V., Eindhoven, NL;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 25/075 (2006.01); H01L 33/52 (2010.01); H01L 33/60 (2010.01); H01L 33/64 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/501 (2013.01); H01L 24/97 (2013.01); H01L 25/0753 (2013.01); H01L 33/52 (2013.01); H01L 33/60 (2013.01); H01L 33/644 (2013.01); H01L 33/505 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0075 (2013.01);
Abstract

In one embodiment, a solid cylindrical tablet is pre-formed for a reflective cup containing an LED die, such as a blue LED die. The tablet comprises uniformly-mixed phosphor particles and transparent/translucent particles of a high TC material, such as quartz, in a hardened silicone binder, where the index of refraction of the high TC material is matched to that of the silicone to minimize internal reflection. Tablets can be made virtually identical in composition and size. The bulk of the tablet will be the high TC material. After the tablet is placed in the cup, the LED module is heated, preferably in a vacuum, to melt the silicone so that the mixture flows around the LED die and fills the voids to encapsulate the LED die. The silicone is then cooled to harden.


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