The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2017

Filed:

Oct. 17, 2016
Applicant:

Northrop Grumman Systems Corporation, Falls Church, VA (US);

Inventors:

Elizabeth T. Kunkee, Manhattan Beach, CA (US);

Charles M. Jackson, Huntington Beach, CA (US);

Dah-Weih Duan, Torrance, CA (US);

Assignee:

Northrop Grumman Systems Corporation, Falls Church, VA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/78 (2006.01); H01P 5/12 (2006.01); H01P 3/08 (2006.01); H01P 1/203 (2006.01); H03H 7/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/78 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01P 1/203 (2013.01); H01P 3/08 (2013.01); H01P 5/12 (2013.01); H03H 7/42 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6683 (2013.01);
Abstract

A system and method for vertically integrating heterogeneous devices into a 3D tile architecture are disclosed. The system uses high precision microelectronics fabrication techniques and known-good-die to achieve high yield to integrate devices to process radio frequency signals at microwave frequencies of approximately 300 MHz to 300 GHz and above. The inventive architecture is based on a high density of small diameter vias to manage the integrity of electrical interconnects and simplify electrical routing.


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