The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2017
Filed:
Dec. 20, 2016
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Barry Jon Male, West Granby, CT (US);
Benjamin Cook, Addison, TX (US);
Robert Alan Neidorff, Bedford, NH (US);
Steve Kummerl, Carrollton, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/38 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/34 (2006.01); H01L 23/498 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/315 (2013.01); H01L 23/3107 (2013.01); H01L 23/345 (2013.01); H01L 23/38 (2013.01); H01L 23/4952 (2013.01); H01L 23/49513 (2013.01); H01L 23/49541 (2013.01); H01L 23/49568 (2013.01); H01L 23/49861 (2013.01); H01L 27/0248 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01);
Abstract
Integrated circuits with a molded package including a cavity and a semiconductor die spaced from an interior surface of the molded package within the cavity. The semiconductor die includes one or more electrical components, a thermal control component to control the temperature of the electrical component, and a driver to provide a current or voltage signal to the thermal control component at least partially according to a setpoint signal.