The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2017
Filed:
Feb. 19, 2016
Applicant:
Kyocera Circuit Solutions, Inc., Kyoto, JP;
Inventor:
Keizou Sakurai, Yasu, JP;
Assignee:
Kyocera Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49833 (2013.01); H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H01L 23/5389 (2013.01); H05K 1/0298 (2013.01); H05K 3/0058 (2013.01);
Abstract
A method of manufacturing a cavity substrate of the present invention includes respectively laminating second and third substrates on upper and lower surfaces of a first substrate having an opening and having an external dimension larger than an external dimension of each of the second and third substrates to ensure that an end portion of the first substrate protrudes a first length from the second and third substrates, and cutting the end portion of the first substrate protruding from each of the second and third substrates to a second length smaller than the first length.