The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2017
Filed:
Apr. 07, 2016
Applicant:
Diodes Incorporated, Plano, TX (US);
Inventors:
Pin-Hao Huang, New Taipei, TW;
Tim C. Chen, Plano, TX (US);
Yeng-Liang Lin, Allen, TX (US);
Bau Shun Huang, New Taipei, TW;
Assignee:
Diodes Incorporated, Plano, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 25/04 (2014.01); H01L 23/373 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3736 (2013.01); H01L 23/3114 (2013.01); H01L 23/495 (2013.01); H01L 23/49537 (2013.01); H01L 23/49575 (2013.01); H01L 25/043 (2013.01); H01L 25/0657 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06589 (2013.01);
Abstract
A rectifier package is provided, which comprises a first rectifier die having an anode and a cathode conductively bonded to a first conductive film on a first surface. The rectifier package also comprises a second rectifier die having an anode and a cathode conductively bonded to the first conductive film on a second surface, which is opposite to the first surface. The first conductive film is in contact with both anodes or both cathodes of the first rectifier die and the second rectifier die.