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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9761505 B1

PDFFull Text
Date of Patent:
Sep. 12, 2017

Filed:

Oct. 23, 2015

Thermal interface material on package

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Isabel De Sousa, Chambly, CA;

Annique Lavoie, Granby, CA;

Eric Salvas, Otterburn Park, CA;

Michel Turgeon, Granby, CA;

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);

Attorneys:

Steven Meyers

Andrew M. Calderon

Roberts Mlotkowski Safran Cole & Calderon, P.C.

Primary Examiner:

Jack Chen

Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/66 (2006.01); H01L 23/04 (2006.01); H01L 23/42 (2006.01); H01L 21/50 (2006.01); H01L 25/00 (2006.01); H01L 21/3105 (2006.01); H01L 21/52 (2006.01); H01L 21/321 (2006.01); H01L 21/324 (2006.01); H01L 23/373 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/3105 (2013.01); H01L 21/321 (2013.01); H01L 21/324 (2013.01); H01L 21/481 (2013.01); H01L 21/4817 (2013.01); H01L 21/4882 (2013.01); H01L 21/50 (2013.01); H01L 21/52 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 22/10 (2013.01); H01L 22/20 (2013.01); H01L 23/04 (2013.01); H01L 23/42 (2013.01); H01L 24/83 (2013.01); H01L 25/50 (2013.01); H01L 22/12 (2013.01); H01L 23/367 (2013.01); H01L 23/3737 (2013.01); H01L 23/50 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/832 (2013.01); H01L 2224/838 (2013.01); H01L 2224/83048 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/83908 (2013.01); H01L 2224/83986 (2013.01); H01L 2924/06 (2013.01); H01L 2924/1659 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/20102 (2013.01);
Abstract

A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

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