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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9761374 B1

PDFFull Text
Date of Patent:
Sep. 12, 2017

Filed:

Nov. 04, 2016

Joining dissimilar materials using an epoxy resin composition

Applicant:

Cooper Technologies Company, Houston, TX (US);

Inventors:

Chao Li, Franklin, WI (US);

Stephen John Rigby, Racine, WI (US);

Clay Lynwood Fellers, Little Mountain, SC (US);

Marco James Mason, Greenwood, SC (US);

Saboura Rokhsair Azar, Milwaukee, WI (US);

Assignee:

COOPER TECHNOLOGIES COMPANY, Houston, TX (US);

Attorney:

King & Spalding LLP

Primary Examiner:

Daniel Lee

Int. Cl.
CPC ...
H01G 4/224 (2006.01); B32B 7/12 (2006.01); B32B 9/04 (2006.01); B32B 15/08 (2006.01); B32B 17/06 (2006.01); B32B 37/12 (2006.01); C09J 163/00 (2006.01); C09J 163/04 (2006.01); H01G 2/10 (2006.01); B32B 9/00 (2006.01); B32B 15/18 (2006.01); H01G 9/10 (2006.01); H01G 4/018 (2006.01); C08J 5/12 (2006.01); C09J 5/06 (2006.01);
U.S. Cl.
CPC ...
H01G 4/224 (2013.01); B32B 7/12 (2013.01); B32B 9/005 (2013.01); B32B 9/041 (2013.01); B32B 15/08 (2013.01); B32B 15/18 (2013.01); B32B 17/061 (2013.01); B32B 37/1284 (2013.01); C08J 5/124 (2013.01); C08J 5/128 (2013.01); C09J 5/06 (2013.01); C09J 163/00 (2013.01); C09J 163/04 (2013.01); H01G 2/103 (2013.01); H01G 4/018 (2013.01); H01G 9/10 (2013.01); B32B 2037/1253 (2013.01); B32B 2250/02 (2013.01); B32B 2255/06 (2013.01); B32B 2255/26 (2013.01); B32B 2305/72 (2013.01); B32B 2307/206 (2013.01); B32B 2307/536 (2013.01); B32B 2310/021 (2013.01); B32B 2311/00 (2013.01); B32B 2315/02 (2013.01); B32B 2315/08 (2013.01); B32B 2457/16 (2013.01); C08J 2463/00 (2013.01); C09J 2400/123 (2013.01); C09J 2400/143 (2013.01); C09J 2400/163 (2013.01); C09J 2400/226 (2013.01); C09J 2463/00 (2013.01); Y10T 428/31518 (2015.04); Y10T 428/31522 (2015.04);
Abstract

An epoxy resin composition is disclosed for joining dissimilar materials. The identified epoxy resin compositions can fee used to seal metallic and non-metallic components of a capacitor. Specifically the epoxy resin composition can be applied to joints between a non-metallic capacitor bushing and a metallic tank cover and metallic terminal cap. Once the epoxy resin composition is cored, it can provide a seal that can withstand the stresses and environmental conditions to which a capacitor is subjected.

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