The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2017

Filed:

Jul. 03, 2014
Applicant:

Toyobo Co., Ltd., Osaka-shi, Osaka, JP;

Inventor:

Satoshi Imahashi, Otsu, JP;

Assignee:

TOYOBO CO., LTD., Osaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); H01B 1/22 (2006.01); C08K 3/08 (2006.01); C08K 7/06 (2006.01); C08K 9/04 (2006.01); C08L 21/00 (2006.01); H01B 1/24 (2006.01); C09D 5/24 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); C08K 3/08 (2013.01); C08K 7/06 (2013.01); C08K 9/04 (2013.01); C08L 21/00 (2013.01); C09D 5/24 (2013.01); H01B 1/24 (2013.01); C08K 2003/085 (2013.01); C08K 2003/0806 (2013.01); C08K 2201/016 (2013.01);
Abstract

The present invention provides an excellent electrically conductive paste which is applicable or printable and stretchable and which ca realize an electrically conductive membrane having high electrical conductivity. An electrically conductive paste wherein a conductive, filler (B) is uniformly dispersed in a resin (A) characterized in that the resin (A) is a rubber (A1) containing sulfur atom and/or a rubber (A2) containing nitrile group, and that the conductive filler (B) is metal powder (B1) having an average particle diameter of 0.5 to 10 μm and a conductive material (B2) having a group selected from mercapto group, amino group and nitrite group on its surface and having an aspect ratio of 10 to 10,000. Instead of having said group on the surface, the conductive filler (B) may be subjected to a surface treatment with a rubber containing sulfide bond and/or nitrite group. Also, the conductive filler (B) may be metal nanowire.


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