The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2017
Filed:
Jul. 06, 2015
Applicant:
Sunasic Technologies, Inc., New Taipei, TW;
Inventors:
Chi-Chou Lin, New Taipei, TW;
Zheng-Ping He, Taipei, TW;
Assignee:
SunASIC Technologies Inc., New Taipei, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/02 (2006.01); H01L 27/14 (2006.01); H01L 23/02 (2006.01); G06K 9/00 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
G06K 9/00053 (2013.01); H01L 27/14618 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/18 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01);
Abstract
A Printed Circuit Board Assembly (PCBA) forming an enhanced fingerprint module is disclosed. The PCBA includes a Printed Circuit Board (PCB), an image sensing chip, at least one electrode and a protection layer. An opening in a first insulation layer and a second insulation layer of the PCB together form a sensor portion so that the image sensing chip can be packaged in the opening. Thus, the thickness of the enhanced fingerprint module can be thinner than other fingerprint modules provided by the conventional package methods.