The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2017

Filed:

Nov. 23, 2015
Applicant:

Hysitron, Inc., Eden Prairie, MN (US);

Inventors:

Yunje Oh, Medina, MN (US);

Syed Amanulla Syed Asif, Bloomington, MN (US);

Edward Cyrankowski, Woodbury, MN (US);

Oden Lee Warren, New Brighton, MN (US);

Assignee:

Hysitron, Inc., Eden Prairie, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/20 (2006.01); H05B 3/10 (2006.01); G01N 1/42 (2006.01); H01J 37/20 (2006.01); G01N 3/08 (2006.01); H05B 1/02 (2006.01); H05B 3/22 (2006.01); G01N 3/18 (2006.01); G01N 3/42 (2006.01);
U.S. Cl.
CPC ...
G01N 1/42 (2013.01); G01N 3/08 (2013.01); H01J 37/20 (2013.01); H05B 1/023 (2013.01); H05B 3/22 (2013.01); G01N 3/18 (2013.01); G01N 3/42 (2013.01); G01N 2203/0226 (2013.01); G01N 2203/0286 (2013.01);
Abstract

A sub-micron scale property testing apparatus including a test subject holder and heating assembly. The assembly includes a holder base configured to couple with a sub-micron mechanical testing instrument and electro-mechanical transducer assembly. The assembly further includes a test subject stage coupled with the holder base. The test subject stage is thermally isolated from the holder base. The test subject stage includes a stage subject surface configured to receive a test subject, and a stage plate bracing the stage subject surface. The stage plate is under the stage subject surface. The test subject stage further includes a heating element adjacent to the stage subject surface, the heating element is configured to generate heat at the stage subject surface.


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