The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2017

Filed:

Feb. 20, 2015
Applicants:

Desikan Bharathan, Lakewood, CO (US);

Kevin Bennion, Littleton, CO (US);

Kenneth Kelly, Evergreen, CO (US);

Sreekant Narumanchi, Littleton, CO;

Inventors:

Desikan Bharathan, Lakewood, CO (US);

Kevin Bennion, Littleton, CO (US);

Kenneth Kelly, Evergreen, CO (US);

Sreekant Narumanchi, Littleton, CO;

Assignee:

U.S. Department of Energy, Washington, DC (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01); F28D 15/00 (2006.01); F28F 13/08 (2006.01); H01L 23/46 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
F28D 15/00 (2013.01); F28F 13/08 (2013.01); H01L 23/46 (2013.01); F28D 2021/0028 (2013.01); F28D 2021/0029 (2013.01);
Abstract

The disclosure provides a fluid-cooled heat sink having a heat transfer base, a shroud, and a plurality of heat transfer fins in thermal communication with the heat transfer base and the shroud, where the heat transfer base, heat transfer fins, and the shroud form a central fluid channel through which a forced or free cooling fluid may flow. The heat transfer pins are arranged around the central fluid channel with a flow space provided between adjacent pins, allowing for some portion of the central fluid channel flow to divert through the flow space. The arrangement reduces the pressure drop of the flow through the fins, optimizes average heat transfer coefficients, reduces contact and fin-pin resistances, and reduces the physical footprint of the heat sink in an operating environment.


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