The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2017
Filed:
Mar. 16, 2015
Applicant:
Ihi Corporation, Koto-ku, JP;
Inventors:
Assignee:
IHI Corporation, Koto-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
F01D 17/16 (2006.01); B22F 3/22 (2006.01); B22F 5/10 (2006.01); F02C 6/12 (2006.01); B22F 3/00 (2006.01); B22F 3/12 (2006.01); B22F 5/00 (2006.01); F02B 37/22 (2006.01); F02B 37/24 (2006.01); B22F 3/10 (2006.01);
U.S. Cl.
CPC ...
F01D 17/16 (2013.01); B22F 3/004 (2013.01); B22F 3/1021 (2013.01); B22F 3/12 (2013.01); B22F 3/225 (2013.01); B22F 5/00 (2013.01); B22F 5/009 (2013.01); B22F 5/10 (2013.01); F01D 17/165 (2013.01); F02B 37/22 (2013.01); F02B 37/24 (2013.01); F02C 6/12 (2013.01); F05D 2220/40 (2013.01); F05D 2230/21 (2013.01); F05D 2260/50 (2013.01); Y02T 10/144 (2013.01);
Abstract
Power transmission members, such as synchronous joint members, are each formed by sintering a compact which is molded from a mixture containing metal powder and a binder, as an injection material, by metal powder injection molding. Flow promotion recesses configured to facilitate a flow of the mixture to areas corresponding to power transmission surfaces or the like when the compact is molded are formed in each of two side surfaces of each power transmission member.