The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2017
Filed:
Mar. 26, 2007
Tomoaki Kimura, Osaka, JP;
Yasuro Araida, Osaka, JP;
Toru Ochiai, Okayama, JP;
Sumito Kiyooka, Okayama, JP;
Tomoaki Kimura, Osaka, JP;
Yasuro Araida, Osaka, JP;
Toru Ochiai, Okayama, JP;
Sumito Kiyooka, Okayama, JP;
Kuraray Co., Ltd., Kurashiki-shi, JP;
Abstract
To prepare a shaped product comprising a thermal adhesive fiber under moisture and having a fiber aggregate nonwoven structure. In the shaped product, the thermal adhesive fibers under moisture are melted to bond to fibers constituting the fiber aggregate nonwoven structure and the bonded fiber ratio is not more than 85%. The shaped product has an apparent density of 0.05 to 0.7 g/cm, a maximum bending stress of not less than 0.05 MPa in at least one direction, and a bending stress of not less than ⅕ of the maximum bending stress at 1.5 times as large as the bending deflection at the maximum bending stress. The moistenable-thermal adhesive fiber may be a sheath-core form conjugated fiber comprising a sheath part comprising an ethylene-vinyl alcohol-series copolymer and a core part comprising a polyester-series resin. Such a shaped product can be used for a building board or the like since the shaped product has a high bending stress although the product is light and has a low density.