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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9758896 B1

PDFFull Text
Date of Patent:
Sep. 12, 2017

Filed:

Feb. 12, 2015

Forming cobalt interconnections on a substrate

Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Roey Shaviv, Palo Alto, CA (US);

John Lam, San Jose, CA (US);

Timothy Bochman, Kalispell, MT (US);

Assignee:

APPLIED Materials, Inc., Santa Clara, CA (US);

Attorneys:

Kenneth H. Ohriner

Perkins Coie LLP

Primary Examiner:

Brian W Cohen

Int. Cl.
CPC ...
C25D 3/12 (2006.01); C25D 3/56 (2006.01); C25D 5/10 (2006.01); C25D 5/18 (2006.01); C25D 5/50 (2006.01); C25D 5/48 (2006.01); C25D 7/12 (2006.01); C25D 17/00 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
C25D 17/001 (2013.01); C25D 3/12 (2013.01); C25D 5/10 (2013.01); C25D 5/18 (2013.01); C25D 5/50 (2013.01); C25D 7/123 (2013.01); H01L 21/6723 (2013.01); H01L 21/67276 (2013.01); H01L 21/67769 (2013.01);
Abstract

A wafer electroplating system has at least one first electroplating chamber having a first electrolyte containing cobalt ions, and is adapted to electroplate a cobalt film onto a wafer at a first deposition rate. A second electroplating chamber has a second electrolyte containing cobalt ions, and is adapted to electroplate a cobalt film onto the wafer at a second deposition rate faster than the first deposition rate. The first and second electroplating chambers are within an enclosure of a processing system. A robot moves a wafer among the first and second electroplating chambers.

Find Patent Forward Citations

Shaviv, Roey. (2017). Forming cobalt interconnections on a substrate (U.S. Patent No. 9758896). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9758896

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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