The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2017
Filed:
Mar. 21, 2014
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Sam K. Lee, Kalispell, MT (US);
Charles Sharbono, Kalispell, MT (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/48 (2006.01); C25D 5/02 (2006.01); C25D 7/12 (2006.01); C25F 3/02 (2006.01); C23C 18/16 (2006.01); H01L 21/768 (2006.01); C25F 3/16 (2006.01); H01L 21/288 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C25D 5/48 (2013.01); C23C 18/1689 (2013.01); C25F 3/02 (2013.01); C25F 3/16 (2013.01); H01L 21/2885 (2013.01); H01L 21/32115 (2013.01); H01L 21/7684 (2013.01); H01L 21/76898 (2013.01); C25D 5/022 (2013.01); C25D 7/12 (2013.01);
Abstract
A non-uniform initial metal film is non-uniformly deplated to provide a more uniform metal film on a substrate. Electrochemical deplating may be performed by placing the substrate in a deplating bath formulated specifically for deplating, rather than for plating. The deplating bath may have a throwing power of 0.3 or less; or a bath conductivity of 1 mS/cm to 250 mS/cm. Reverse electrical current conducted through the deplating bath non-uniformly. electro-etches or deplates the metal film.