The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2017
Filed:
May. 08, 2014
Applicant:
Ymt Co., Ltd., Incheon, KR;
Inventor:
Sung Wook Chun, Incheon, KR;
Assignee:
YMT CO., LTD., Incheon, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 5/02 (2006.01); B32B 15/01 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/06 (2006.01); H05K 3/18 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
C25D 5/02 (2013.01); B32B 15/017 (2013.01); C25D 5/022 (2013.01); H05K 1/03 (2013.01); H05K 1/09 (2013.01); H05K 3/025 (2013.01); H05K 3/062 (2013.01); H05K 3/188 (2013.01); H05K 2203/0152 (2013.01); Y10T 428/12479 (2015.01); Y10T 428/24917 (2015.01);
Abstract
One embodiment of the present disclosure provides a method for producing a substrate formed with a copper thin layer. The method includes providing a carrier, forming a separation-inducing layer on the surface of the carrier, forming a copper thin layer on the separation-inducing layer, and bonding a core to the copper thin layer.
Chun, Sung. (2017). Method for producing substrate formed with copper thin layer, method for manufacturing printed circuit board and printed circuit board manufactured thereby (U.S. Patent No. 9758889). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9758889
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile