logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9758863 B1

PDFFull Text
Date of Patent:
Sep. 12, 2017

Filed:

Jul. 15, 2015

Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Tatsuhiko Miura, Yokkaichi, JP;

Kazuhiro Murakami, Yokkaichi, JP;

Assignee:

TOSHIBA MEMORY CORPORATION, Minato-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Timon Wanga

Int. Cl.
CPC ...
C23C 14/00 (2006.01); C23C 14/35 (2006.01); H01L 23/552 (2006.01); H01J 37/32 (2006.01); C23C 14/34 (2006.01); C23C 14/50 (2006.01); H01J 37/34 (2006.01);
U.S. Cl.
CPC ...
C23C 14/35 (2013.01); C23C 14/3407 (2013.01); C23C 14/50 (2013.01); H01J 37/32715 (2013.01); H01L 23/552 (2013.01); H01J 37/345 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06537 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/15311 (2013.01);
Abstract

In one embodiment, a semiconductor manufacturing apparatus includes a carrier having first and second ends extending in a first direction, and third and fourth ends extending in a second direction and being not shorter than the first and second ends. The apparatus further includes a member holder having a magnet placement face on which first and second magnetic-pole portions are placed, the magnet placement face having fifth and sixth ends extending in the first direction and being shorter than the first and second ends, and seventh and eighth ends extending in the second direction, being longer than the fifth and sixth ends, and being longer than the third and fourth ends. The apparatus further includes a carrier transporter transporting the carrier along the first direction. The carrier transporter can transport the carrier such that the third and fourth ends pass under a center line of the magnet placement face.

Find Patent Forward Citations

Miura, Tatsuhiko. (2017). Semiconductor manufacturing apparatus and method of manufacturing semiconductor device (U.S. Patent No. 9758863). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9758863

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…