The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2017

Filed:

Mar. 27, 2015
Applicants:

Teijin Limited, Osaka, JP;

Tsukishima Kikai Co., Ltd., Tokyo, JP;

Inventors:

Tatsuichirou Kon, Osaka, JP;

Tatsuya Ekinaka, Osaka, JP;

Hiroshi Kishimoto, Osaka, JP;

Yume Morita, Osaka, JP;

Takehiro Suga, Osaka, JP;

Satoshi Ogata, Tokyo, JP;

Masato Nakagomi, Tokyo, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 7/04 (2006.01); C08J 7/12 (2006.01); B05D 3/02 (2006.01); C23C 16/40 (2006.01); C23C 16/50 (2006.01); C23C 16/02 (2006.01);
U.S. Cl.
CPC ...
C08J 7/045 (2013.01); B05D 3/0254 (2013.01); C08J 7/123 (2013.01); C23C 16/0254 (2013.01); C23C 16/401 (2013.01); C23C 16/50 (2013.01); C08J 2369/00 (2013.01); C08J 2433/08 (2013.01); C08J 2483/04 (2013.01);
Abstract

The present invention realizes a polymer substrate with hard coating layer comprising a high level of environmental resistance and a high level of abrasion resistance. A polymer substrate with hard coating layer is provided that comprises a polymer substrate () having a thickness of 1 mm to 20 mm and a hard coating layer () on the surface thereof. Here, in this polymer substrate with hard coating layer, the hard coating layer () is laminated on the surface of the polymer substrate, contains as a main component thereof a hydrolysis-condensation product of an organic silicon compound, has a thickness of 0.1 μm to 20 μm, makes direct contact with a cured underlayer on the opposite side of the polymer substrate, is formed from an organic silicon compound by PE-CVD, and satisfies all of the following requirements (a) to (c): (a) film thickness of the silicon oxide layer is within the range of 3.5 μm to 9.0 μm, (b) maximum indentation depth of the surface of the silicon oxide layer as determined by measuring nanoindentation under conditions of a maximum load of 1 mN is 150 nm or less, and (c) the value of critical compression ratio K of the silicon oxide layer, as defined by formula (1) in a 3-point bending test of the polymer substrate with hard coating layer that imparts indentation displacement in which the surface laminated with the silicon oxide layer becomes concave, is 0.975 or less.


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