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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9757893 B1

PDFFull Text
Date of Patent:
Sep. 12, 2017

Filed:

Jul. 11, 2017

Method of manufacturing a resin-laminated board

Applicant:

Kyoraku Co., Ltd., Kyoto, JP;

Inventors:

Yoshitaka Matsubara, Kanagawa, JP;

Tadatoshi Tanji, Kanagawa, JP;

Assignee:

KYORAKU CO., LTD, Kyoto-Shi, Kyoto, JP;

Attorney:

Troutman Sanders LLP

Primary Examiner:

Timothy Kennedy

Int. Cl.
CPC ...
B29C 33/00 (2006.01); B29C 51/26 (2006.01); B62D 43/00 (2006.01); B32B 27/00 (2006.01); B60R 13/01 (2006.01); B62D 43/10 (2006.01); B32B 3/30 (2006.01); B32B 3/28 (2006.01); B29C 33/30 (2006.01); B29C 49/62 (2006.01); B29C 49/48 (2006.01); B29C 49/20 (2006.01); B29C 49/02 (2006.01); B29C 49/04 (2006.01); B29L 31/30 (2006.01); B29L 24/00 (2006.01); B29L 7/00 (2006.01);
U.S. Cl.
CPC ...
B29C 51/267 (2013.01); B29C 33/306 (2013.01); B29C 49/48 (2013.01); B32B 3/28 (2013.01); B32B 3/30 (2013.01); B32B 27/00 (2013.01); B60R 13/013 (2013.01); B62D 43/005 (2013.01); B62D 43/10 (2013.01); B29C 49/04 (2013.01); B29C 2049/021 (2013.01); B29C 2049/2017 (2013.01); B29C 2049/4812 (2013.01); B29C 2049/627 (2013.01); B29L 2007/002 (2013.01); B29L 2024/006 (2013.01); B29L 2031/3017 (2013.01); Y10T 428/24612 (2015.01);
Abstract

A method of manufacturing a resin-laminated board by preparing a pair of first and second split molds each of which is provided with a cavity; positioning two sheet materials made of a thermoplastic resin between the first and second split molds with the cavities of the first and second split molds opposed to each other; forming a plurality of recesses by recessing a first sheet material toward a second sheet material with use of a plurality of protrusions provided to the first split mold; and welding bottoms of the recesses to the second sheet material by clamping the pair of first and second split molds to obtain a resin-laminated board with a hollow structure. A mold includes a plurality of piece members, disposed at the cavity of the first split mold; and includes the protrusions and male screws provided to base ends of the protrusions.

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