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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9757818 B1

PDFFull Text
Expired
Date of Patent:
Sep. 12, 2017

Filed:

Oct. 20, 2016

Thermally decomposable polymer compositions for forming microelectronic assemblies

Applicant:

Promerus, Llc, Brecksville, OH (US);

Inventors:

W. C. Peter Tsang, Brecksville, OH (US);

Andrew Bell, Brecksville, OH (US);

Hongshi Zhen, Brecksville, OH (US);

Keitaro Seto, Brecksville, OH (US);

Assignee:

PROMERUS, LLC, Brecksville, OH (US);

Attorney:

Balaram Gupta

Primary Examiner:

Ling Choi

Assistant Examiner:

Gennadiy Mesh

Int. Cl.
CPC ...
B23K 35/36 (2006.01); B23K 35/02 (2006.01); C09D 167/02 (2006.01); H05K 3/34 (2006.01); C08G 69/26 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B23K 35/3618 (2013.01); B23K 35/025 (2013.01); B23K 35/0244 (2013.01); B23K 35/0255 (2013.01); B23K 35/36 (2013.01); B23K 35/3612 (2013.01); B23K 35/3613 (2013.01); B81C 1/00317 (2013.01); C09D 167/02 (2013.01); H05K 3/3489 (2013.01); B81C 1/00301 (2013.01); B81C 2201/019 (2013.01); H05K 2203/0485 (2013.01);
Abstract

A thermally decomposable polymer composition comprising a polyester of a dicarboxylic acid and a tertiary cyclohexanediols of Formulae V and VI are disclosed, which are useful in the forming of microelectronic assemblies: a representative example of a dicarboxylic acid is an oxalic acid and representative example of thermally decomposable polyester is the polyester of the formula: wherein m is at least about 100.

Find Patent Forward Citations

Tsang, W. C. Peter. (2017). Thermally decomposable polymer compositions for forming microelectronic assemblies (U.S. Patent No. 9757818). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9757818

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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