The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2017
Filed:
Jan. 21, 2016
Applicant:
Mitsui High-tec, Inc., Kitakyushu-shi, Fukuoka, JP;
Inventors:
Akihiro Hashimoto, Fukuoka, JP;
Kenichirou Iwata, Fukuoka, JP;
Assignee:
MITSUI HIGH-TEC, INC., Fukuoka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 28/14 (2006.01); B21D 28/22 (2006.01); H02K 15/00 (2006.01);
U.S. Cl.
CPC ...
B21D 28/14 (2013.01); B21D 28/22 (2013.01); H02K 15/00 (2013.01);
Abstract
A die apparatus includes a first die and a second die which are respectively used in adjacent working stations that sequentially blank or stamp out a progressively fed thin metal sheet. The first and second dies are held in a state where outer peripheral surfaces of the first and second dies directly contact each other.