The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2017

Filed:

May. 17, 2016
Applicant:

Sungwoo Hitech Co., Ltd., Busan, KR;

Inventors:

Sanghyun Park, Busan, KR;

Rae Hyeong Kim, Busan, KR;

Mun Yong Lee, Busan, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 26/02 (2011.01); B21D 26/027 (2011.01); B21D 26/031 (2011.01); B21D 26/055 (2011.01);
U.S. Cl.
CPC ...
B21D 26/027 (2013.01); B21D 26/031 (2013.01); B21D 26/055 (2013.01);
Abstract

A multi-forming device is disclosed. A multi-forming device according to an exemplary embodiment of the present invention may include: a lower mold die; a lower mold that is disposed at a center upper surface of the lower mold die, in which a gas passage is formed in an up-and-down direction to receive a shaping gas from an outside gas supplier device, in which a lower mold surface is formed at an upper surface thereof, and in which a plurality of heating cartridges are disposed therein along the lower surface thereof; an upper mold that is disposed on an upper side slider to be moved in an up-and-down direction corresponding to the lower mold, in which an upper mold surface is formed at a lower surface corresponding to the lower mold, in which an upper mold face is formed at a circumference of the upper mold surface, and in which a plurality of heating cartridges are disposed along the upper mold surface; a blank holder through which the lower mold is inserted and that is disposed to move in an up-and-down direction through a cushion spring on the lower mold die, and in which a holder face is formed to grasp a material together with the upper mold face at an early stage of a forming process; an inner gas pipe that is disposed in a gas passage of the lower mold; and a switch valve that switches supply passages of the shaping gas that is supplied to the inner gas pipe and the gas passage.


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