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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9756741 B1

PDFFull Text
Date of Patent:
Sep. 05, 2017

Filed:

Feb. 04, 2016

Electronic assembly and method of manufacture same

Applicant:

Trw Automotive U.s. Llc, Livonia, MI (US);

Inventors:

Mike Blossfeld, South Lyon, MI (US);

Luis Fermando Sanchez, Commerce Township, MI (US);

Assignee:

TRW Automotive U.S. LLC, Livonia, MI (US);

Attorney:

Tarolli, Sundheim, Covell & Tummino LLP

Primary Examiner:

Hung S Bui

Int. Cl.
CPC ...
H05K 5/00 (2006.01); H01R 13/66 (2006.01); H01R 12/50 (2011.01); H01R 12/72 (2011.01); H01R 13/506 (2006.01); H01R 43/20 (2006.01); H01R 13/41 (2006.01); H01R 43/16 (2006.01); H01R 43/18 (2006.01); H05K 5/02 (2006.01); H05K 7/14 (2006.01); H01R 13/447 (2006.01); H02G 3/08 (2006.01); H02G 3/16 (2006.01);
U.S. Cl.
CPC ...
H05K 5/006 (2013.01); H01R 12/724 (2013.01); H01R 13/41 (2013.01); H01R 13/506 (2013.01); H01R 13/6658 (2013.01); H01R 23/7073 (2013.01); H01R 43/16 (2013.01); H01R 43/18 (2013.01); H01R 43/20 (2013.01); H01R 43/205 (2013.01); H05K 5/003 (2013.01); H05K 5/0047 (2013.01); H05K 5/0052 (2013.01); H05K 5/0239 (2013.01); H05K 7/1428 (2013.01); H01R 13/447 (2013.01); H01R 2201/26 (2013.01); H02G 3/086 (2013.01); H02G 3/16 (2013.01); Y10S 439/941 (2013.01); Y10T 29/49002 (2015.01); Y10T 29/4922 (2015.01); Y10T 29/49117 (2015.01); Y10T 29/49204 (2015.01); Y10T 29/49208 (2015.01); Y10T 29/49222 (2015.01);
Abstract

An electronic assembly comprises a housing, a cover for the housing, a printed circuit board receivable in the housing, and a compliant pin header assembly. The compliant pin header assembly is mountable in the housing by inter-engaging features on the header assembly and the housing. The compliant pin header assembly has compliant pins for engaging corresponding features on the printed circuit board to connect the compliant pin header assembly electrically to the printed circuit board. The cover, when the electronic assembly is assembled, engages the housing and also engages the printed circuit board at a location spaced from an outer periphery of the printed circuit board.

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