The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2017
Filed:
Dec. 03, 2015
Kiyokawa Plating Industry Co., Ltd., Fukui-shi, Fukui, JP;
KIYOKAWA PLATING INDUSTRY CO., LTD, Fukui-shi, JP;
Abstract
A process for efficiently producing a wiring board in which an insulating substratehaving a through holeis used, which includes forming a seed layeron one surface of the insulating substrate, covering the surface of the insulating substrateon which the seed layeris formed with a masking film, arranging the insulating substrateand a positive electrodeso that the surface of the insulating substrateopposite to the surface of the insulating substrateon which the seed layerof the insulating substrateis formed is faced to the positive electrode, carrying out electroplating to form a metal layerin the through hole, and then removing the masking film
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile