The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2017
Filed:
Nov. 28, 2013
Peking University Founder Group Co., Ltd., Beijing, CN;
Zhuhai Founder Tech. Hi-density Electronic Co., Ltd., Zhuhai, CN;
Founder Information Industry Holdings Co., Ltd., Beijing, CN;
Xianren Chen, Zhuhai, CN;
Baowei Ren, Zhuhai, CN;
PEKING UNIVERSITY FOUNDER GROUP CO., LTD., Beijing, CN;
ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC CO., LTD., Zhuhai, CN;
FOUNDER INFORMATION INDUSTRY HOLDINGS CO., LTD., Beijing, CN;
Abstract
A method for manufacturing a back drilling hole in a printed circuit board (PCB) and PCB are provided. The method for manufacturing the back drilling hole comprises: forming a through hole in the PCB (); forming a metal layer () with prescribed thickness on an inner wall of the through hole; filling resin in the through hole which has been formed with the metal layer (); performing back drilling machining on the through hole which has been filled with the resin; removing metal scraps remained in the through hole. The manufacturing method protects the hole wall copper by filling the hole with the resin, so that acid corrosion process only removes the remained metal scraps after back drilling of the small hole, does not affect on the hole copper of the resin protecting portion.