The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

Oct. 21, 2011
Applicants:

Andreas Steffen Klein, Freigericht, DE;

Eckhard Ditzel, Linsengericht, DE;

Frank Krüger, Nidderau, DE;

Michael Schumann, Neu-Ulm, DE;

Inventors:

Andreas Steffen Klein, Freigericht, DE;

Eckhard Ditzel, Linsengericht, DE;

Frank Krüger, Nidderau, DE;

Michael Schumann, Neu-Ulm, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/13 (2006.01); H01L 23/36 (2006.01); H01L 33/60 (2010.01); H01L 23/00 (2006.01); H05K 3/00 (2006.01); H01L 33/48 (2010.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); H01L 23/13 (2013.01); H01L 23/36 (2013.01); H01L 24/32 (2013.01); H01L 33/60 (2013.01); H05K 3/00 (2013.01); H01L 33/486 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83385 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H05K 3/4084 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2054 (2013.01); H05K 2203/0278 (2013.01); H05K 2203/049 (2013.01); H05K 2203/063 (2013.01); H05K 2203/1484 (2013.01); Y10T 29/49002 (2015.01);
Abstract

A laminate and method for producing the laminate are provided for contacting at least one electronic component. An insulating layer is laminated between first and second metal layers electrically contacted to each other in at least one contact region. At least one recess in the contact region is generated with at least one embossing and/or bulging in the first metal layer. The distance between the two metal layers is reduced, such that dimensions of the embossing/bulging are sufficient for taking up the electronic component, which is inserted and connected into the embossing/bulging in a conductive manner therein. The electronic component is taken up in the embossing/bulging entirely with respect to its circumference and at least partly with respect to the height (H) of the electronic component. The laminate may be used as a circuit board, sensor, LED lamp, mobile phone component, control, or regulator.


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