The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2017
Filed:
Jan. 22, 2014
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventors:
Yuji Kataoka, Kyoto, JP;
Koichi Kanryo, Kyoto, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/28 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0216 (2013.01); H01L 24/97 (2013.01); H05K 1/0218 (2013.01); H05K 3/284 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/19105 (2013.01); H05K 2201/0245 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/0715 (2013.01); H05K 2203/1316 (2013.01);
Abstract
A module board includes a base substrate. Electronic components are mounted on a first principal surface of the base substrate. The mounted electronic components are sealed by a sealing resin containing an SiOfiller. A top surface and side surfaces of the sealing resin are covered with a shield layer containing a carbon filler, which is flat powder, as a conductive component. A terminal electrode is formed on a second principal surface of the base substrate that is disposed opposite to the first principal surface of the base substrate.