The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2017
Filed:
Feb. 20, 2014
Applicant:
Continental Automotive Gmbh, Hannover, DE;
Inventors:
Michael Decker, Regensburg, DE;
Thomas Riepl, Bad Abbach, DE;
Assignee:
Continental Automotive GmbH, Hannover, DE;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H05K 1/0207 (2013.01); H05K 1/18 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H05K 1/021 (2013.01); H05K 1/0204 (2013.01); H05K 1/0206 (2013.01); H05K 1/0209 (2013.01); H05K 1/056 (2013.01); H05K 1/185 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10303 (2013.01); H05K 2201/10409 (2013.01);
Abstract
An electronic, optoelectronic or electric arrangement contains a circuit carrier having a metallic heat conductor, and a component, which is embedded, inserted or formed in the circuit carrier. The component has at least one electric, electronic or optoelectronic construction element and a rewiring layer, which contains a metallic heat conducting path. A metallic-thermal connection of the rewiring layer and the metallic heat conducting layer of the circuit carrier is provided by the heat conducting path.