The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

Mar. 04, 2015
Applicant:

Sensors Unlimited, Inc., Princeton, NJ (US);

Inventors:

John T. Foster, Jersey City, NJ (US);

John Tagle, Cherry Hill, NJ (US);

Dmitry Zhilinsky, Princeton, NJ (US);

Michael A. Liland, Princeton, NJ (US);

Laszlo Kovacs, Middlesex, NJ (US);

Leonardo C. Gonzales, West Chester, PA (US);

Assignee:

Sensors Unlimited, Inc., Princeton, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 5/378 (2011.01); H01L 23/29 (2006.01); H01L 23/556 (2006.01); H01L 23/00 (2006.01); H01L 27/146 (2006.01); G06T 5/40 (2006.01); H04N 5/32 (2006.01); H04N 5/33 (2006.01);
U.S. Cl.
CPC ...
H04N 5/378 (2013.01); G06T 5/40 (2013.01); H01L 23/291 (2013.01); H01L 23/295 (2013.01); H01L 23/556 (2013.01); H01L 23/57 (2013.01); H01L 23/573 (2013.01); H01L 27/14618 (2013.01); H04N 5/32 (2013.01); H04N 5/33 (2013.01); G06T 2207/10116 (2013.01); H01L 27/1465 (2013.01);
Abstract

A multi-tiered approach to combating reverse engineering of electronics is disclosed herein. The encapsulant utilized with the optical sensor may be selected based on being substantially being opaque to X-ray inspection. In this way, visible public inspection to gain competitive intelligence may be reduced and operation of the electronics may remain unaffected. Additionally, a thin filament of wire embedded just below the surface of the encapsulant could be used as an electronic tripwire in response to being severed and/or dissolved by the reverse engineering strong solvents and acids.


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