The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

Jan. 13, 2014
Applicant:

Cisco Technology, Inc., San Jose, CA (US);

Inventors:

Stefan Pfnuer, San Jose, CA (US);

Ravi Kachru, San Jose, CA (US);

John Fangman, Leesport, PA (US);

Utpal Chakrabarti, Allentown, PA (US);

Assignee:

Cisco Technology, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/50 (2013.01); G02B 6/42 (2006.01); H05K 13/00 (2006.01); H01L 33/64 (2010.01); H01L 33/52 (2010.01); H01S 5/022 (2006.01); H01S 5/024 (2006.01); H01S 5/02 (2006.01); H01S 5/026 (2006.01);
U.S. Cl.
CPC ...
H04B 10/503 (2013.01); G02B 6/4208 (2013.01); G02B 6/4236 (2013.01); G02B 6/4249 (2013.01); G02B 6/4251 (2013.01); G02B 6/4271 (2013.01); H01L 33/52 (2013.01); H01L 33/64 (2013.01); H05K 13/00 (2013.01); H01S 5/02 (2013.01); H01S 5/0265 (2013.01); H01S 5/02236 (2013.01); H01S 5/02288 (2013.01); H01S 5/02415 (2013.01); Y10T 29/49002 (2015.01); Y10T 29/4913 (2015.01); Y10T 29/49126 (2015.01); Y10T 29/49778 (2015.01); Y10T 29/49815 (2015.01); Y10T 29/49826 (2015.01); Y10T 29/53174 (2015.01); Y10T 29/53178 (2015.01);
Abstract

A method of manufacturing an optical communication device aligns an optical sub-assembly and an optical modulator on a carrier wafer. A first sub-mount supports the optical sub-assembly and a second sub-mount supports the optical modulator. Pre-defined break lines are placed on the carrier wafer to accommodate separation of the sub-assembly and the optical modulator. The first sub-mount connects the optical sub-assembly to a thermoelectric cooler by either an epoxy, a spacer layer, or both. The optical sub-assembly is aligned in the x/y/z directions relative to the second sub-mount in a position to match an optical height of the optical modulator in the z-direction, wherein the z-direction is a vertical direction relative to the carrier wafer.


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