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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9755192 B1

PDFFull Text
Date of Patent:
Sep. 05, 2017

Filed:

Dec. 11, 2015

Method of cutting substrate and method of manufacturing display apparatus

Applicant:

Samsung Display Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

Junghwa You, Yongin-si, KR;

Taeyong Kim, Yongin-si, KR;

Hyojin Kim, Yongin-si, KR;

Ilyoung Jeong, Yongin-si, KR;

Gyoowan Han, Yongin-si, KR;

Jekil Ryu, Yongin-si, KR;

Jinho Lee, Yongin-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:

Lewis Roca Rothgerber Christie LLP

Primary Examiner:

Jami M Valentine

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 51/56 (2006.01); B23K 26/38 (2014.01); B23K 26/0622 (2014.01); B23K 26/18 (2006.01); B23K 26/06 (2014.01); B23K 26/40 (2014.01); B23K 26/402 (2014.01); H01L 51/52 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/56 (2013.01); B23K 26/0608 (2013.01); B23K 26/0624 (2015.10); B23K 26/18 (2013.01); B23K 26/38 (2013.01); B23K 26/40 (2013.01); B23K 26/402 (2013.01); B23K 2203/00 (2013.01); B23K 2203/42 (2015.10); B23K 2203/50 (2015.10); H01L 51/5253 (2013.01); H01L 2251/566 (2013.01);
Abstract

A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.

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