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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9755126 B1

PDFFull Text
Date of Patent:
Sep. 05, 2017

Filed:

Jun. 26, 2013

Light source unit

Applicant:

Ushio Denki Kabushiki Kaisha, Tokyo, JP;

Inventors:

Yoshihisa Yokokawa, Himeji, JP;

Yoshihiro Kanahashi, Himeji, JP;

Manabu Mori, Himeji, JP;

Assignee:

Ushio Denki Kabushiki Kaisha, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Vip Patel

Int. Cl.
CPC ...
H01J 1/62 (2006.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 23/00 (2006.01); F21V 29/70 (2015.01); F21V 23/00 (2015.01); F21V 23/06 (2006.01); H01L 33/08 (2010.01); F21Y 105/10 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); F21V 23/005 (2013.01); F21V 23/06 (2013.01); F21V 29/70 (2015.01); H01L 24/32 (2013.01); H01L 25/0753 (2013.01); H01L 33/08 (2013.01); F21Y 2105/10 (2016.08); F21Y 2115/10 (2016.08); H01L 2224/26175 (2013.01); H01L 2224/27013 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01);
Abstract

A light source unit includes a plurality of LED elements disposed on a plurality of band-shaped wirings on a substrate. The LED elements on one band-shaped wiring are electrically connected by wires to an adjacent band-shaped wiring. The LED elements are disposed on the substrate in a staggered arrangement as a whole. The LED elements can be densely disposed without poor connection occurring in the wires connected to the band-shaped wirings, and effective cooling can be carried out without impeding the dissipation of heat from the LED elements. One or more damming channels are formed between each two adjacent LED elements on each band-shaped wiring. A non-effusion region is formed, into which no solder flows, between each two adjacent LED elements. The wires are connected to the non-effusion regions.

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